^{3M Circuit Plating Tape 851}

^{聚酯薄膜膠帶 851 電鍍遮蔽膠帶  高性能抗電鍍}

3M Circuit Plating Tape 851 is a Greenback Printed Circuit Board Tape ( polyester film) with a unique conformable adhesive for printed circuit board masking during electroplating.

• Polyester backing reduces stretch and recovery of tape associated with uneven stop-off line.
• Thick adhesive coating reduces undercutting because adhesive blocks out solutions between fingers.
• Specially designed adhesive that generally performs better when no ovens are used to heat tape and boards.

• For masking printed circuit boards during solder stripping and precious metal plating of fingers.
• Splicing of silicone coated papers.

Adhesive: Blended silicone & rubber 矽橡膠
Backing: Polyester Film  PET
Backing Thickness: 0.9 mil (0.02 mm)
Total Thickness: 4.0 mils (0.10 mm)
Color: Transparent green
Tensile Strength at Break: 26.8 lbs./in. width (368 N/100 mm)
Elongation: (% at break) 124%
Adhesion to Steel: 29 oz./in. width (27 N/100 mm)

Temperature Range Max.: 155°C

Standard Roll Length 36yd

3M 851膠帶 半透明綠色 厚 0.9mil 薄膜 具抗化性  用於印刷電路板之鍍金遮蔽  耐溫 155°C

^{3M 851J LED Potting Tape}

^{聚酯薄膜膠帶 851J 電鍍遮蔽膠帶}

3M LED Potting Tape 851J is a green polyester film tape with a unique adhesive system, which effectively seals and protects during the potting process of the manufacturing of LED faceplates.

• Can be applied by hand or automated machine.
• Low shrink polyester film helps to improve optical quality of LED parts.
• Provides the same sealing and protecting properties and produces the same matte finish as 3M  LED Potting Tape 851.
• Unique blended, high cure adhesive for no epoxy leakage and clean removal to improve productivity.
• Reduce optical defects for improved epoxy finish and fewer rejected parts.
• Ultra clean adhesive for reducing contamination and less rework.

• Sealing and protection during LED potting process.

Adhesive: Blended silicone & rubber
Backing: Polyester Film
Backing Thickness: 1.2 mils (0.03 mm)
Total Thickness: 3.6 mils (0.09 mm)
Color: Transparent green
Tensile Strength at Break: 29 lbs./in. width (398 N/100 mm width)
Elongation: (% at break) 250%
Adhesion to Steel: 30 oz./in. width (28 N/100 mm width)

Standard Roll Length 36yd

851J   半透明綠色 厚 0.09mm

• 適合許多場合並提供絕佳的遮蔽保護
• 其產品可承受的溫度範圍從-40度到155度之間
• 在高溫中不會變形扭曲或熔化
• 特別設計在高溫時使用

^{3M 470 電鍍膠帶  電鍍遮蔽膠帶}

3M Electroplating Tape 470 is a conformable and abrasion-resistant vinyl tape with excellent resistance to most chemicals used in typical electroplating processes. 3M  Electroplating Tape 470L is a linered version of 3M vinyl tape 470 that may be used for die-cutting or large area applications.

Backing: Pigmented vinyl

AdhesiveAdhesion to Steel: 37 oz./in. width (40.4 N/100 mm)
Tensile Strength at Break: 20 lbs./in. width (350 N/100 mm)
Elongation at Break: 180%
Backing Thickness: 6.3 mils (0.16 mm)
Total Tape Thickness (without liner): 7.1 mils (0.18 mm)
Liner Thickness: 6.1 mils (0.15 mm)
Temperature Use Range: Up to 250°F (121°C)

• Excellent resistance to most chemicals used in typical electroplating operations.
• Prolonged exposure to elevated temperatures (above 250°F/121°C) and hot caustics may cause weakening of the adhesive bond.
• Can be qualified to meet Federal Specification HH-T-0025 (GSA-FSS) Ammendment 2.
• Resists most common solvents, care should be taken to avoid ketones, chlorinated hydrocarbons, and esters, found in lacquer thinners, degreasers, paint strippers, etc., which may cause the backing to swell or curl.

• Vinyl backing is conformable

• Backing accepts marker ink and is printable in using the thermal transfer process.

• Masking during many electroplating operations, including both flat strip and overlapping masks.
• Wrapping, patching, coated racks and masking many irregular surfaces.
• Labeling.
• Sealing containers from water intrusion.

 

3M Tape 470 應用於在電鍍和陽極氧化作業中使用

具有優異的抗化學性 抗大多數常見溶劑

具有耐磨損、防潮和耐磨性，能耐受惡劣的工作環境
具有貼合背襯，適用於曲面和不規則表面

橡膠膠粘劑在多種表面上提供優異的保持強度
對於需要耐電鍍且耐大多數陽極氧化工藝中使用的化學品的膠帶應用，請使用3M電鍍膠帶470。

應用領域:  電力維護/維修/保養   金屬加工業  適用於電鍍化學品、陽極氧化化學品、銑削、蝕刻和錘擊操作。 電鍍 masking，陽極電鍍 masking.