Major Applications

Needs-Properties Required

Recommended Tapes

Layer Insulation Hold Down

固定絕緣包覆材質

1. Holding (固定) - High bond adhesive to adhere to magnet wire and to layer insulation material (could be Nomex)
2. Insulating (絕緣) - ECF of 1.0 on magnet wire 28 AWG or smaller.

Lead Tap Anchor

固定漆包線線頭

1. Holding (固定) - High bond adhesive to adhere to  magnet wire and adhesive-to-adhesive bond (cut and fold). Good edge tear resistance.
2. Insulating (絕緣) - ECF of 1.0 on magnet wire 28 AWG or smaller.

Up End and Cross Over

1. Insulating High dielectric strength Usually must meet UL requirements. High bond adhesive to adhere to magnet wire and layer insulation (could be Nomex)

Lead Pad & Lead Pad Hold Down

1. Insulating (絕緣) - Minimal. Considered is series with the outer wrap. ECF of 1.0 on magnet wire 28 AWG and smaller.
2. Holding (固定) - High bond adhesive to adhere to magnet wire, lead assembly material, pad tape. Edge-tear resistance to meet possible pullout requirements.
3. Mechanical Protection, Cushioning - Puncture resistant. To prevent penetration of soldered connections. Hot solder resistance to avoid burn-through.

Coil Banding

1. Holding (固定) - Good tensile, low stretch, high bond  adhesive to adhere to layer insulation (could be Nomex) and its own backing to avoid flagging. Conformability.

Terminal Strip Anchoring

1. Holding (固定) - High bond adhesive to adhere to , layer insulation (could be Nomex) and S20 terminal strip material. Good tensile, Edge tear, puncture and hot solder resistance.

End Cap

1. Insulating (絕緣) - Dielectric strength commensurate with  design requirements. High tack adhesive to adhere to layer insulation (could be Nomex). Conformability to avoid flagging. Adhesive must not contaminate varnish tank.

Outer Wrap

1. Insulating (絕緣) - Dielectric strength should be , commensurate with design 1318 requirements. ECF of 1.0 with wire 28 AWG or smaller if in contact with wire.
2.  Mechanical Protection - Puncture resistance to penetration by soldered connection. Edge-tear resistance to meet pull-out requirements.
3. Holding (固定) - High bond adhesive to adhere to layer insulation (could be Nomex) and to its own backing. Flagging resistance in solvents.
4. Identifying - Printable and stripeable (used for color coding)

1. Holding (固定) - Quick stick to bobbin and to magnet , wire. Thin tape usually required.
2. Insulating (絕緣) -Dielectric strength commensurate with application. ECF of 1.0 on magnet wire 28 AWG or smaller.

1. Insulating (絕緣) -Dielectric strength commensurate with application. ECF of 1.0 on magnet wire 28 AWG or smaller.
2. Mechanical Protection - Resistance to penetration by solder burrs or other pointed objects. Must be resistant to hot solder if connection is made on coil.

1. Insulating (絕緣) -Dielectric strength commensurate with application. ECF of 1.0 on magnet wire 28 AWG or smaller.
2. Holding (固定) -Third hand. High bond adhesive to adhere to lead assembly material, pad tape and magnet wire. Good edge tear if used as outer wrap.
3. Mechanical Protection Cushioning - Resistance to penetration of soldered connections.

1. Holding (固定) - High bond adhesive to adhere to  magnet wire. Edge tear resistance.
2. Insulating (絕緣) - Minimal  ECF of 1.0 for magnet wire 28 AWG or smaller.

1. Insulating (絕緣) - Quick stick to magnet wire.  Dielectric strength commensurate with the application. Cut-through resistance sufficient for the application, wire size, temperature. Conformability to fillet bobbin flanges to prevent wind downs.

1. Mechanical Protection - Quick stick and high bond adhesive to adhere to magnet wire and avoid  flagging.   Solvent resistance required in some applications, with no thermosetting cycle in most cases. Puncture and hot solder resistance if lead connections are made.
2. Insulating- Dielectric strength commensurate with application. ECF of 1.0 if used on magnet wire 28 AWG or smaller.  UL requirements balancing thickness and electric strength.  How many wraps currently used to achieve insulation required?
3. Holding (固定) - Edge-tear resistance and high bond adhesive to meet lead pull requirements.
4. Flame Retardancy - Company safety requirements to increase product reliability. (some Company component listing UL applications) Subject 510 material spec.
5. Identifying - Printable and stripeable (used for color coding)
6. Aesthetics - Smooth outer wrap conformable to fillet bobbin flanges. Opacity often required.

1. Insulation - Quick stick to capacitor.  Dielectric strength commensurate with capacitor design.   Spec. No. E.C.F. of 1.0
2. Identification - Ink receptivity of tape backing to produce clearly defined and well anchored printing.
3. Environmental Protection - Solvent resistance. Specification No. 8 and test values expected.  Flagging resistance test method, if applicable.  Dielectric constant.  Operating temperature (Mostly 125° C)   Pertinent specification on overall capacitor performance.

1. Holding (固定) -High bond adhesive to adhere to  magnet wire and own backing.    Resists flagging in solvents and heat during manufacturing and end use.
2. Insulation - Dielectric strength commensurate with application. ECF of 1.0 on magnet wire 28 AWG or smaller.

1. Holding (固定) - High bond adhesive to adhere to wire and own backing. Resists flagging in solvents and heat during manufacturing and end use. Conformability.
2. Insulation - Dielectric strength commensurate with application. ECF of 1.0 on magnet wire 28 AWG or smaller.

1.  Holding (固定) - High bond adhesive to adhere to wire and our backing. Flagging resistance  in solvent and heat. Conformability. Good tensile strength. High temperature shear strength. Puncture resistant.

Properties

Glass Cloth

Polyester Film

Acetate Cloth

Paper

Polyester Film

Epoxy Film

(volts)

2500-3000

5000

2000-3000

1500-2000

5000

6500

(mils)

7.0-7.5

2.2-3.2

8.0-10.5

5.0-9.0

5.0

5.5

Recognition

Yes1

Yes(130°C)

No

No

Yes(130°C)

Yes(150°C)

Recognition

No2

No3

No

No

No

Yes

Tear Resistance

Excellent

Good

Poor

Poor

Good

Good

Conformability

Excellent

Poor

Excellent

Good-Exc.

Good

Good

Factor

1.0

1.0

Cotton-.85

.8

1.0

1.0

Hot Solder Resistance

Good

Poor

Poor

Excellent

Good

Excellent

(lbs.)

18-30

9.5

Cotton-16

2.7-7.6

14

11.5

(lbs./inch)

150-180

20-25

40-50

35-45

40

40-50

Temperature Class

See1

130°C

105°C

105°C

130°C

130°C